Ferrotec 的 MeiVac MCT-8000 枚葉式RF Diode濺鍍系統是可於直徑200mm的基板上進行Al₂O₃、SiO₂、Ta₂O₅等金屬氧化物薄膜的成膜作業，濺鍍沈積速率高達950A/min，是量產型枚葉式系統。本系統係特別針對HDD讀寫頭方面的應用進行優化，但在其他例如化合物半導體領域中亦具備極高的應用潛力。

MCT-8000的系統色特如下：

• 可相容於無塵室作業環境：透過隔離的前面板將主系統與無塵室的生產作業區分離
• 採模組化設計：可依照產能需求彈性進行擴充
• 高度自動化：採用Brooks MX-600枚葉式平台，搭配Mag 7機械手臂作業
• 生產製造：內建可程編之SECS/GEM，可與Fab的MES系統連線作業

MeiVac MCT-8000 枚葉式濺鍍系統的部分規格羅列如下：

• Production-proven 24/7 cluster tool
• Fully automated processing of up to 200mm ∅ substrates
• Available with 2 to 4 process modules and with 2 load-locks
  Process modules are field retrofittable
• Brooks MX-600 cluster platform with Mag 7 robot
• Every chamber has a dedicated slot valve and pump stack with turbo & water pump
• Cassette present sensor, wafer present sensors, and wafer slideout sensors
• Aligner with notch detection and orientation
• Wafer temperature sensor
• Integrated RGA for system control
• Optimized for Hard Disk Drive Thin Film Head application
• Al2O3, SiO2, Ta2O5…
  From 0.2μ to 23μ for Al2O3
  O2 process capable for enhanced side wall coverage
• <1.0% sigma/mean uniformity and layer concentricity
• High rate deposition processes (>950A/min)
• Proprietary, multi-MFC gas distribution system for process modules
• Helium backside gas cooling
• RF substrate bias option to enhance deposited film properties
• Available for metal or reactive dielectric material deposition
• Windows 7 based UI and GE RX3i Programmable Logic Controller (PLC)
• Profibus communications to key components on the system
• Configurable SECS/GEM option for communication with most fabs’ Manufacturing Execution Systems (MES)