Lift-Off 製程用電子束蒸鍍系統

Temescal 從1952年成立至今，是一家專注於電子鎗鍍膜技術的領導者，其設備已普遍使用於LED、光學、無線通訊、二極體與功率元件等領域，尤其在化合物半導體產業（compound semiconductors），其對於薄膜均勻性的要求達到 1.0% 的嚴苛條件下，Temescal 設備在此市場的佔有率更高達 60% 以上。

Temescal 的專業技術及經驗，是客戶穩定量產、突破製程瓶頸最有力的支援，而俊尚科技代理 Temescal 已超過 20 年，這讓我們具備豐富的銷售、裝機、維修、改裝能力；此外，我們也提供原廠快速的技術 / 製程支援服務，可以快速有效的回應客戶需求，讓客戶在製程以及設備維運上無後顧之憂。各款系統的規格請參考下列內容。

Next-Gen Precision E-beam Evaporator for 200mm

有鑑於5G與節能環保風潮驅動第三代化合物半導體（GaN、SiC）的快速發展，因而催生出對於更大基材（Φ200mm）的電子束鍍膜設備的需求，Temescal的UEFC-6100將可帶給您更大的產能（25片Φ200mm晶圓 / 批次）、更快的生產週期，以及優異的基板上成膜的性能，這部份請參考下圖。

Precision E-beam Evaporators for Mass Production

FC-3800

Wafer Size	100mm
Production Chamber Type	Box
Load Lock to Isolate Production Chamber	Yes
Cryopump water L/sec	21,500
Pump Down Time	1E-06 Torr, < 20mins
E-gun (max pkg)	6x25cc PopTop
E-gun Power Supply	6 or 12 kW
Max wafer count: Lift off	25x150mm 14x200mm
Source to Substrate: std	34"
Source to Substrate: ext	38"

FC-4400

Wafer Size	150&200mm
Production Chamber Type	Box
Load Lock to Isolate Production Chamber	Yes
Cryopump water L/sec	44,000
Pump Down Time	1E-06 Torr, < 10mins
E-gun (max pkg)	6x25cc PopTops
E-gun Power Supply	6 or 12kW
Max wafer count: Lift off	30x150mm 15x200mm
Source to Substrate: std	38"
Source to Substrate: ext	42"

UEFC-4900

Wafer Size	150mm
Production Chamber Type	Conic
Load Lock to Isolate Production Chamber	Yes
Cryopump water L/sec	36,500
Pump Down Time	1E-06 Torr, < 10mins
E-gun (max pkg)	6x25cc PopTops
E-gun Power Supply	6 or 12 kW
Max wafer count: Lift off	25x150mm
Source to Substrate: std	35.5"
Source to Substrate: ext	-

UEFC-5700

Wafer Size	150&200mm
Production Chamber Type	Conic
Load Lock to Isolate Production Chamber	Yes
Cryopump water L/sec	44,000
Pump Down Time	1E-06 Torr, < 10mins
E-gun (max pkg)	6x25cc PopTops
E-gun Power Supply	6 or 12kW
Max wafer count: Lift off	42x150mm 21x200mm
Source to Substrate: std	43"
Source to Substrate: ext	-

E-beam Evaporators for R&D / Pilot Production

FC-2000

Production Chamber Type	Bell jar
Load Lock to Isolate Production Chamber	No
Cryopump water L/sec	4,000
Pump Down Time	1E-06 Torr，< 15mins
E-gun (max pkg)	6x25cc PopTop
E-gun Power Supply	6 or 12 kW
Max wafer count: Lift off	42x2" 13x100mm
Source to Substrate: std	19.5"
Source to Substrate: ext	27.5"

FC-2800

Production Chamber Type	Box
Load Lock to Isolate Production Chamber	Yes
Cryopump water L/sec	21,500
Pump Down Time	1E-06 Torr，< 20mins
E-gun (max pkg)	6x25cc PopTop
E-gun Power Supply	6 or 12 kW
Max wafer count: Lift off	25x100mm 12x150mm
Source to Substrate: std	34"
Source to Substrate: ext	42"

Application	University, R&D, Pilot Production
Production Chamber Type	Bell jar
Load Lock to Isolate Production Chamber
Cryopump water L/sec	4,000
Pump Down Time	1E-06 Torr，< 15mins
E-gun (max pkg)	6 x 25cc PopTop
E-gun Power Supply	6 or 12 kW
Max wafer count: Lift off	42 x 2", 13 x 100mm
Source to Substrate: std	19.5"
Source to Substrate: ext	27.5"


Application	University, R&D, Pilot Production
Production Chamber Type	Box
Load Lock to Isolate Production Chamber	Yes
Cryopump water L/sec	21,500
Pump Down Time	1E-06 Torr，< 20mins
E-gun (max pkg)	6 x 25cc PopTop
E-gun Power Supply	6 or 12 kW
Max wafer count: Lift off	25 x 100mm, 12 x 150mm
Source to Substrate: std	34"
Source to Substrate: ext	42"


Application	Production: 100mm
Production Chamber Type	Box
Load Lock to Isolate Production Chamber	Yes
Cryopump water L/sec	21,500
Pump Down Time	1E-06 Torr，< 20mins
E-gun (max pkg)	6 x 25cc PopTop
E-gun Power Supply	6 or 12 kW
Max wafer count: Lift off	25 x 150mm, 14 x 200mm
Source to Substrate: std	34"
Source to Substrate: ext	38"


Application	Production: 150 & 200mm
Production Chamber Type	Box
Load Lock to Isolate Production Chamber	Yes
Cryopump water L/sec	44,000
Pump Down Time	1E-06 Torr，< 10mins
E-gun (max pkg)	6 x 25cc PopTops
E-gun Power Supply	6 or 12kW
Max wafer count: Lift off	30 x 150mm, 15 x 200mm
Source to Substrate: std	38"
Source to Substrate: ext	42"


Application	Ultimate Uniformity Production: 150mm
Production Chamber Type	Conic
Load Lock to Isolate Production Chamber	Yes
Cryopump water L/sec	36,500
Pump Down Time	1E-06 Torr，< 10mins
E-gun (max pkg)	6 x 25cc PopTops
E-gun Power Supply	6 or 12 kW
Max wafer count: Lift off	25 x 150mm
Source to Substrate: std	35.5"
Source to Substrate: ext	-


Application	Ultimate Uniformity Production: 150 & 200mm
Production Chamber Type	Conic
Load Lock to Isolate Production Chamber	Yes
Cryopump water L/sec	44,000
Pump Down Time	1E-06 Torr，< 10mins
E-gun (max pkg)	6 x 25cc PopTops
E-gun Power Supply	6 or 12kW
Max wafer count: Lift off	42 x 150mm, 21 x 200mm
Source to Substrate: std	43"
Source to Substrate: ext	-

有鑑於5G與節能環保風潮驅動第三代化合物半導體（GaN、SiC）的快速發展，因而催生出對於更大基材（Φ200mm）的電子束鍍膜設備的需求，Temescal的UEFC-6100將可帶給您更大的產能（25片Φ200mm晶圓 / 批次）、更快的生產週期，以及優異的基板上成膜的性能，這部份請參考下圖。

temescal uefc6100 benefits