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德國 Thin Film Consulting (TFC)憑藉著慎密的設計以及在研究與工業量產領域所累積的多年經驗,開發出IONIX系列磁控濺鍍鎗具備優異的薄膜沈積速率、靶材利用率以及膜厚均勻性,除了可廣泛應用於傳統各類濺鍍應用外,亦可應用於鐵-磁類材料之濺鍍、HIPIMS以及反應式濺鍍。IONIX 系列磁控濺鍍鎗具備下列特色:

  • 磁鐵陣列與冷卻水路採隔離式設計,避免磁鐵被腐蝕
  • 複極式磁鐵陣列設計可提升靶材利用率,減少貴金屬成本
  • 可於 5 x 10-4 mbar以下的真空氛圍下使用,提升薄膜品質

IONIX® 高真空圓形濺鍍源

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Circular IONIX® sputtering sources for high vacuum applications:

  • target-Ø 50 – 300 mm (2” – 12”)
  • standardized interfaces (KF/ISO)
  • flange or internal mounting
  • various magnet array options
  • for use with DC-, RF- or HiPIMS processes
  • for fundamental research and small scale production
  • more than 450 sources supplied

Mechanical and mounting options:

  • with or without chimney
  • +/- 45° tilt or 40° insitu-tilt
  • Pneumatic, electric or manual shutter
  • Gas distribution
  • Quick coupling feedtrough for wall-mounting
  • Z-Manipulator
  • Flange mounting option
  • RF-Power option

Magnetic options:

  • balanced/unbalanced
  • high target utilization
  • high film thickness uniformity
  • low pressure operation

IONIX® 超高真空圓形濺鍍源

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Circular IONIX® sputtering sources for ultra high vacuum applications:

  • Target-Ø 25.4 – 300 mm (1” – 12”)
  • Standardized interfaces (CF)
  • For use with DC-, RF- or HiPIMS processes
  • For fundamental research
  • Particular features:
    • metallic seals vacuum-to-atmosphere
    • no water-to-vacuum seals
    • magnets separated from cooling water
    • with magnets bakeable up to 200°C

Mechanical and mounting options:

  • with or without chimney
  • +/- 45° tilt or 40° insitu-tilt
  • Pneumatic, electric or manual shutter
  • Gas distribution
  • Quick coupling feedtrough for wall-mounting
  • Z-Manipulator
  • Flange mounting option
  • RF-Power option

Magnetic options:

  • balanced/unbalanced
  • high target utilization
  • high film thickness uniformity
  • low pressure operation

IONIX® 高真空長方形濺鍍源

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IONIX® rectangular magnetron sputtering sources with advanced water cooling circuits are designed for industrial production purposes and are available in a wide range of widths and lengths. The utilized directed cooling water flow and multipolar magnet arrays accomodate the use of clamped targets at power levels of 20W/cm2 (Cr, Al) and above. The rectangular magnetron sputtering sources can be internally mounted with standard vacuum interfaces (KF, CF, ISO) or on external flanges with dimensions as requested by system design.

  • Standardized target widths
  • Standardized interfaces (ISO/CF)
  • Internal/external mounting
  • Directly/indirectly cooled targets
  • Internal gas distribution
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target width "A"   target length "B"   cathode width "C"   cathode length "D"   total height "H" 
63mm / 2.5"   200mm... 1000mm   102mm   B+40mm   64mm
89mm / 3.5"   250mm... 2000mm   135mm   B+47mm   75mm
100mm / 4‘‘   300mm… 2000mm   147mm   B+47mm   66mm
127mm / 5‘‘   300mm… 4000mm   172mm   B+47mm   71mm
152mm / 6‘‘   500mm… 4000mm   205mm   B+57mm   80mm
200mm / 8‘‘    900mm… 4000mm   265mm   B+75mm   84mm