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所有CCR Technology COPRA 的電漿源皆採無燈絲式(filamentless)低壓感應耦合RF射頻設計,電漿源內建可調式匹配網路,可讓電漿能源之傳輸效率達至最佳。而 COPRA 所產生的中性電漿(亦即電漿內有著接近等量的離子與電子,所形成的電荷平衡狀態),在導體或絕緣體基材上的薄膜沈積、蝕刻或表面改質等應用上,可有效減少電荷累積的狀態。

由於採用獨特電漿激發機制,不論製程所使用的是哪種氣體,COPRA 電漿源在氣體解離率表現均超過 90%,讓 COPRA 電漿源所產生的電漿密度可達 1x1012/cm3 以上,對各種類別的應用更具重要性;各種款式的電漿源也可對應客製化的尺寸需求。CCR Technology 的 COPRA 電漿源,其特色如下:

  • 能產生極大之離子電流密度
  • 離子能量(Ion Energy) 可獨立控制,不因RF電源的輸出大小而變化。可針對特定製程設定所需的離子能量,抑制膜質缺陷的生成
  • 可廣泛應用於各種電漿製程,例如:離子輔助蒸鍍、離子輔助反應性濺鍍、電漿輔助化學氣相沉積、電漿表面改質與清潔、電漿蝕刻應用等
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COPRA Linear Sources

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LS360x200-GRPE
  • Plasma Opening: 360mmx200mm
  • Matching: Integrated Remote Match
  • RF Power: 5kW @ 13.56MHz
  • Pressure Range: 2x10-4 ~ 1x10-2 mbar
  • Substrate Size (static): -
  • Substrate Width (dynamic): 300mm 
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LS500x500-DPRPE
  • Plasma Opening: 500mmx500mm
  • Matching: Integrated Remote Match
  • RF Power: 5kW @ 13.56MHz
  • Pressure Range: 5x10-4 ~ 1x10-1 mbar
  • Substrate Size (static): 400mmx400mm
  • Substrate Width (dynamic): - 
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LS670x203-GRPE
  • Plasma Opening: 670mmx200mm
  • Matching: Integrated Remote Match
  • RF Power: 5kW @ 13.56MHz
  • Pressure Range: 2x10-4 ~ 1x10-2 mbar
  • Substrate Size (static): -
  • Substrate Width (dynamic): 600mm 
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LS800x250-DPRPE
  • Plasma Opening: 800mmx250mm
  • Matching: Integrated Remote Match
  • RF Power: 6kW @ 13.56MHz
  • Pressure Range: 5x10-4 ~ 1x10-1 mbar
  • Substrate Size (static): -
  • Substrate Width (dynamic): 700mm 
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LS1100x202-GRPE
  • Plasma Opening: 1100mmx200mm
  • Matching: Integrated Remote Match
  • RF Power: 6kW or 8kW @ 13.56MHz
  • Pressure Range: 3x10-4 ~ 1x10-2 mbar
  • Substrate Size (static): -
  • Substrate Width (dynamic): 1000mm 
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LS1300x202-GRPE
  • Plasma Opening: 1300mmx200mm
  • Matching: Integrated Remote Match
  • RF Power: 6kW or 8kW @ 13.56MHz
  • Pressure Range: 5x10-4 ~ 1x10-2 mbar
  • Substrate Size (static): -
  • Substrate Width (dynamic): 1200mm 

COPRA Ring Sources

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RS400-DPR
  • Plasma Opening: Ø 400 mm
  • Matching: Integrated Remote Match
  • RF Power: 5kW @ 13.56MHz
  • Pressure Range: 5x10-4 ~ 1x10-1 mbar
  • Substrate Size (static): Ø 300 mm (12"Wafer)
  • Substrate Width (dynamic): -
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RS500x500-DPR
  • Plasma Opening: 500mmx500mm
  • Matching: Integrated Remote Match
  • RF Power: 5kW @ 13.56MHz
  • Pressure Range: 5x10-4 ~ 1x10-1 mbar
  • Substrate Size (static): 400mmx400mm
  • Substrate Width (dynamic): -
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RS700x600-DPR
  • Plasma Opening: 700mmx600mm
  • Matching: Integrated Remote Match
  • RF Power: 6kW or 10kW @ 13.56MHz
  • Pressure Range: 5x10-4 ~ 1x10-1 mbar
  • Substrate Size (static): 550mmx450mm
  • Substrate Width (dynamic): -
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RS850x850-DPR
  • Plasma Opening: 850mmx850mm
  • Matching: Integrated Remote Match
  • RF Power: 6, 10 or 15kW @ 13.56MHz
  • Pressure Range: 5x10-4 ~ 1x10-1 mbar
  • Substrate Size (static): 700mmx700mm
  • Substrate Width (dynamic): -
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RS1000x300-DPR
  • Plasma Opening: 1000mmx300mm
  • Matching: Integrated Remote Match
  • RF Power: 6 or 10kW @ 13.56MHz
  • Pressure Range: 5x10-4 ~ 1x10-1 mbar
  • Substrate Size (static): -
  • Substrate Width (dynamic): 900mm
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RS1000x402-DPR
  • Plasma Opening: 1000mmx400mm
  • Matching: Integrated Remote Match
  • RF Power: 6 or 10kW @ 13.56MHz
  • Pressure Range: 5x10-4 ~ 1x10-1 mbar
  • Substrate Size (static): -
  • Substrate Width (dynamic): 900mm

COPRA Round Sources

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DN 160-CF-GM
  • Plasma Opening: Ø 84 mm
  • Matching: Manual
  • RF Power: 0.6kW @ 13.56MHz
  • Pressure Range: 1x10-4 ~ 1x10-2 mbar
  • Substrate Size (static): Ø 80 mm (3"Wafer)
  • Substrate Width (dynamic): -
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DN201-X-GM
  • Plasma Opening: Ø 110 mm
  • Matching: Manual
  • RF Power: 1.2kW @ 13.56MHz
  • Pressure Range: 1x10-4 ~ 1x10-1 mbar
  • Substrate Size (static): Ø 100 mm (4"Wafer)
  • Substrate Width (dynamic): -
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DN250-CF-GRPE
  • Plasma Opening: Ø 152 mm
  • Matching: Remote
  • RF Power: 1.6kW @ 13.56MHz
  • Pressure Range: 1x10-4 ~ 1x10-2 mbar
  • Substrate Size (static): Ø 150 mm (6"Wafer)
  • Substrate Width (dynamic): -
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DN251-ISO-K-EGRPE
  • Plasma Opening: Ø 154 mm
  • Matching: Integrated Remote Match
  • RF Power: 3kW @ 13.56MHz
  • Pressure Range: 1x10-4 ~ 1x10-2 mbar
  • Substrate Size (static): Ø 150 mm (6"Wafer)
  • Substrate Width (dynamic): -
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DN401-GRPE
  • Plasma Opening: Ø 244 mm
  • Matching: Integrated Remote Match
  • RF Power: 5kW @ 13.56MHz
  • Pressure Range: 1x10-4 ~ 1x10-2 mbar
  • Substrate Size (static): Ø 200 mm (8"Wafer)
  • Substrate Width (dynamic): -
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DN501-GRPE
  • Plasma Opening: Ø 380 mm
  • Matching: Integrated Remote Match
  • RF Power: 5kW @ 13.56MHz
  • Pressure Range: 1x10-4 ~ 1x10-2 mbar
  • Substrate Size (static): Ø 300 mm (12"Wafer)
  • Substrate Width (dynamic): -

COPRA Built-in Sources

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IS201-G(I)R(PE)
  • Plasma Opening: Ø 110 mm
  • Matching: Integrated Remote Match
  • RF Power: 1.2kW @ 13.56MHz
  • Pressure Range: 1x10-4 ~ 1x10-1 mbar
  • Substrate Size (static): up to 760mm calotte/dome size
  • Substrate Width (dynamic): -
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IS201-EG(I)R(PE)
  • Plasma Opening: Ø 110 mm
  • Matching: Integrated Remote Match
  • RF Power: 1.2kW @ 13.56MHz
  • Pressure Range: 1x10-4 ~ 1x10-1 mbar
  • Substrate Size (static): up to 760mm calotte/dome size
  • Substrate Width (dynamic): -
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IS301-EGIRPE
  • Plasma Opening: Ø 220 mm
  • Matching: Integrated Remote Match
  • RF Power: 3kW @ 13.56MHz
  • Pressure Range: 1x10-4 ~ 1x10-2 mbar
  • Substrate Size (static): up to 1100mm calotte/dome size
  • Substrate Width (dynamic): -
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IS400-EGIRPE
  • Plasma Opening: Ø 250 mm
  • Matching: Integrated Remote Match
  • RF Power: 5kW @ 13.56MHz
  • Pressure Range: 1x10-4 ~ 1x10-2 mbar
  • Substrate Size (static): up to 1500mm calotte/dome size
  • Substrate Width (dynamic): -
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IS502-EGIRPE
  • Plasma Opening: Ø 320 mm
  • Matching: Integrated Remote Match
  • RF Power: 7kW @ 13.56MHz
  • Pressure Range: 1x10-4 ~ 1x10-2 mbar
  • Substrate Size (static): up to 2000mm calotte/dome size
  • Substrate Width (dynamic): -
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IS1100x250-GRPE
  • Plasma Opening: 1100mmx250mm
  • Matching: Integrated Remote Match
  • RF Power: 6kW @ 13.56MHz
  • Pressure Range: 5x10-4 ~ 1x10-2 mbar
  • Substrate Size (static): -
  • Substrate Width (dynamic): 1000mm

Plasma Monitoring System (Faraday Cup CEA4)

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The CCR Faraday Cup CEA4 Plasma Monitoring System through it allows to precisely. Out measure the plasma parameters as:

  • Ion Energy Distribution IED
  • Ion Energy
  • Ion Current Density
  • Ion Energy vs Time 

Find out the best operational parameters for your existing and in particular new coater design and processes in order to ensure highest performances of your systems.