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With our unparalleled expertise in metallization for the processing of Compound Semiconductor based substrates, Temescal systems provide controlled multi-layer coatings of materials such as Ti, Pt, Au, Pd, Ag, Ni, Al, Cr, Cu, Mo, Sn, SiO2 and ITO with highly repeatable guaranteed uniformity and performance metrics.

Today the world’s most sophisticated HB-LED lighting, wireless, ophthalmic lens, triple junction PV solar, precision optic and telecom sub-systems rely on millions of devices that are made using Temescal deposition systems and components.

The cooperation between Temescal and Junsun Tech has been lasting for almost 30 years. We have successfully introduced more than 40 Temescal systems to the world's #1 compound semiconductor wafer foundry company. For applications such as MMIC and SAW/BAW filters, the demand for lift-off yield, high throughput and material utilization are critical.

As new compound semiconductor materials are being developed for power devices, we believe there are plenty opportunities to be explored with Temescal systems.

FC-2000 / BJD-2000


Convertible Bell Jar for
Small-Scale Production and R&D Applications

FC-2800 / BCD-2800


Mid-Sized Coaters for
Production and Large-Wafer R&D Applications

FC-3800


Ideal for Production Lift-Off,
Step-Coverage,
and Dual-Sided Coating Applications

FC-4400


Load Locked and
Optimized for Lift-Off Processes

UEFC-4900


Ultimate Uniformity in Lift-Off Processes
Optimized for 150mm Wafers

UEFC-5700


Ultimate Throughtput in Lift-Off Processes
with 150mm or 200mm Wafers

Inquiry for Temescal System