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Lift-Off 製程用電子束蒸鍍系統

 tm banner thermal

Temescal 從1952年成立至今,是一家專注於電子鎗鍍膜技術的領導者,其設備已普遍使用於LED、光學、無線通訊、二極體與功率元件等領域,尤其在化合物半導體產業(compound semiconductors),其對於薄膜均勻性的要求達到 1.0% 的嚴苛條件下,Temescal 設備在此市場的佔有率更高達 60% 以上。

Temescal 的專業技術及經驗,是客戶穩定量產、突破製程瓶頸最有力的支援,而俊尚科技代理 Temescal 已超過 20 年,這讓我們具備豐富的銷售、裝機、維修、改裝能力;此外,我們也提供原廠快速的技術 / 製程支援服務,可以快速有效的回應客戶需求,讓客戶在製程以及設備維運上無後顧之憂。各款系統的規格請參考下列內容。

temescal benefits 750x


 

Next-Gen Precision E-beam Evaporator for 200mm

有鑑於5G與節能環保風潮驅動第三代化合物半導體(GaN、SiC)的快速發展,因而催生出對於更大基材(Φ200mm)的電子束鍍膜設備的需求,Temescal的UEFC-6100將可帶給您更大的產能(25片Φ200mm晶圓 / 批次)、更快的生產週期,以及優異的基板上成膜的性能,這部份請參考下圖。


 

Precision E-beam Evaporators for Mass Production

 

FC-3800

Wafer Size100mm
Production Chamber Type Box
Load Lock to Isolate Production Chamber Yes
Cryopump water L/sec 21,500
Pump Down Time 1E-06 Torr, < 20mins
E-gun (max pkg) 6x25cc PopTop
E-gun Power Supply 6 or 12 kW
Max wafer count: Lift off 25x150mm
14x200mm
Source to Substrate: std 34"
Source to Substrate: ext 38"

 

 

FC-4400

Wafer Size150&200mm
Production Chamber Type Box
Load Lock to Isolate Production Chamber Yes
Cryopump water L/sec 44,000
Pump Down Time 1E-06 Torr, < 10mins
E-gun (max pkg) 6x25cc PopTops
E-gun Power Supply 6 or 12kW
Max wafer count: Lift off 30x150mm
15x200mm
Source to Substrate: std 38"
Source to Substrate: ext 42"

 

 

UEFC-4900

Wafer Size150mm
Production Chamber Type Conic
Load Lock to Isolate Production Chamber Yes
Cryopump water L/sec 36,500
Pump Down Time 1E-06 Torr, < 10mins
E-gun (max pkg) 6x25cc PopTops
E-gun Power Supply 6 or 12 kW
Max wafer count: Lift off 25x150mm
Source to Substrate: std 35.5"
Source to Substrate: ext -

 

 

UEFC-5700

Wafer Size150&200mm
Production Chamber Type Conic
Load Lock to Isolate Production Chamber Yes
Cryopump water L/sec 44,000
Pump Down Time 1E-06 Torr, < 10mins
E-gun (max pkg) 6x25cc PopTops
E-gun Power Supply 6 or 12kW
Max wafer count: Lift off 42x150mm
21x200mm
Source to Substrate: std 43"
Source to Substrate: ext -

 


 

E-beam Evaporators for R&D / Pilot Production

 temescal bjd2000

FC-2000

Production Chamber TypeBell jar
Load Lock to Isolate Production Chamber No
Cryopump water L/sec 4,000
Pump Down Time 1E-06 Torr,< 15mins
E-gun (max pkg) 6x25cc PopTop
E-gun Power Supply 6 or 12 kW
Max wafer count: Lift off 42x2"
13x100mm
Source to Substrate: std 19.5"
Source to Substrate: ext 27.5"

 

 temescal fc2800

FC-2800

Production Chamber TypeBox
Load Lock to Isolate Production Chamber Yes
Cryopump water L/sec 21,500
Pump Down Time 1E-06 Torr,< 20mins
E-gun (max pkg) 6x25cc PopTop
E-gun Power Supply 6 or 12 kW
Max wafer count: Lift off 25x100mm
12x150mm
Source to Substrate: std 34"
Source to Substrate: ext 42"