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Temescal Systems for Compound Semiconductors

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About Temescal

With our unparalleled expertise in metallization for the processing of Compound Semiconductor based substrates, Temescal systems provide controlled multi-layer coatings of materials such as Ti, Pt, Au, Pd, Ag, Ni, Al, Cr, Cu, Mo, Sn, SiO2 and ITO with highly repeatable guaranteed uniformity and performance metrics.

Today the world’s most sophisticated HB-LED lighting, wireless, ophthalmic lens, triple junction PV solar, precision optic and telecom sub-systems rely on millions of devices that are made using Temescal deposition systems and components.

Market Status

The cooperation between Temescal and Junsun Tech has been lasting for almost 30 years. We have successfully introduced more than 40 Temescal systems to the world's #1 compound semiconductor wafer foundry company. For applications such as MMIC and SAW/BAW filters, the demand for lift-off yield, high throughput and material utilization are critical.

As new compound semiconductor materials are being developed for power devices, we believe there are plenty opportunities to be explored with Temescal systems.

FC-2000/BJD-2000
Convertible Bell Jar for Small-Scale Production and R&D Applications
FC-2800/BCD-2800
Mid-Sized Coaters for Production and Large-Wafer R&D Applications
FC-3800
Ideal for Production Lift-Off, Step-Coverage, and Dual-sided Coating Applications
FC-4400
Load Locked and Optimized for Lift-Off Processes
UEFC-4900
Ultimate Uniformity in Lift-Off Processes Optimized for 150mm Wafers
UEFC-5700
Ultimate Throughput in Lift-Off Processes with 150mm or 200mm Wafers


Inquiry for Temescal System

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