Thermal Evaporation System

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Thermal evaporation deposition technology has been widely adopted in organic optoelectronics and it is becoming an industrial standard in the fabrication of OLED, OPV, OTFT and so on. This technology has been so well-developed that it can deposit small molecule organic materials which forms functional layers in the OLED device and deposit fine mask-patterned metal thin film which forms the electrode. Junsun's themal evaporation systems have been designed to fabricate small-sized substrates for evaluating / qualifying organic material properties and layer stacks performance. This is an essential step for material research and migrating R&D parameters to mass produciton system. Designed with multi-substrates carrying system and compact source tray in mind, our thermal evaporation systems deliver benefits such as enhanced material utilisation rate (reducing material cost), good uniformity over every substrate (good for top-emission OLED devices) and multiple results (up to 10 independent results) in 1 single batch. Our thermal evaporation systems consume less process time, effectively reduce material cost and have following features:

 

  • Stable hardware performance: substrate carrier system, evaporation sources, QCM sensor heads or chamber geometry have been seriously simulated, deisgned, manufactured and test-verified. This guarantees stable and repeatable deposition performance. 
  • Flexible experiment setup: different parameters can be applied to each substrate on the carrier system. By so doing, multiple outputs in 1 single batch can be achieved.
  • Clean process environment: particle generation is minimized by special pumping / venting sequence, which ensures a clean process envuronment.
  • Clean deposition source: mechanical materials are high temperature & HV compatible, no impurities released during source heating process.
  • Stable deposition rate: automatic rate control vis PID. A well-developed PID (depending on materials and deposition rate) will guarantee rate stability < 5%.
  • Expandability: plasma system, solution process equipment or thin film encapsulation system (PECVD+IJP) can be integrated to Jusun's thermal evaporation systems via our engineering service

 

Example of co-deposition

oled result1
  • In this example we demonstrate OLED co-deposition process using host / dopant materials
  • In this example, tooling factor of dopant rate has been magnified by 10 times
  • In this example, PID has been optimized based on material properties and process paramters