Since 1952, Temescal has long been the innavator & leader of e-beam evaporation technology. Temescal's e-beam systems have been widely used in industries such as LED, optics, wireless communication, compound semiconductors and so on. Take compound semiconductor application for instance, the requiment for thin film uniformity across 6" or 8" wafer is less than 1%, which is the key factor that effects the yield of lift-off process. Temescal has developed industry-proven solutions to vastly improve thickness uniformity and that's why Temescla has 60% of market in the field. With over 65 years' experiences and expertise in the e-beam technology, Temescal provides the most reliable products to customers across the globe. Following are Temescal's e-beam system information.
R&D / Pilot System
| Spec | FC-2000 | FC-2800 |
|---|
| Appearance |
 |
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| Load Lock to isolate Product Chamber and Source Chamber |
Yes (Option) |
Yes (Option) |
| Chamber Type |
Bell Jar |
Box |
| Pump down time |
10-6 < 15mins |
10-6 < 10mins |
| Max wafer count: Lift off |
42 x 2", 13 x 100mm |
12 x 150mm, 25 x 100mm |
| Source to Substrate: Standard |
19.5” |
34" |
| Source to Substrate: Extension |
27.5" |
43" |
Standard Production Systems
| Spec | FC-3800 | FC-4400 |
|---|
| Appearance |
 |
 |
| Load Lock to isolate Product Chamber and Source Chamber |
Yes |
Yes |
| Chamber Type |
Box |
Box |
| Planetary Doom |
Yes (Option) |
Lift-off only |
| Pump down time |
10-6 < 20mins |
10-6 < 10mins |
| Max wafer count: Lift off |
25 x 150mm, 53 x 100mm |
30 x 150mm, 15 x 200mm |
| Source to Substrate: Standard |
34” |
38" |
| Source to Substrate: Extension |
38" |
42" |
High Precision Production System
| Spec | UF-4900 | UF-5700 |
|---|
| Appearance |
 |
 |
| Load Lock to isolate Product Chamber and Source Chamber |
Yes |
Yes |
| Chamber Type |
Box |
Box |
| Doom |
HULA |
HULA |
| Pump down time |
10-6 < 10mins |
10-6 < 10mins |
| Max wafer count: Lift off |
25 x 150mm |
42 x 150mm, 21 x 200mm |
| Source to Substrate: Standard |
35.5” |
43" |
Outstanding System Features
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Load-Lock Gate Valve
This valve isolates the production chamber (where wafer carrier is housed) and the source chamber (where e-gun source is housed).
The 2 chambers is isolated and each chamber has its own cryogenic pump and can be operated independently.
With this feature, it can not only reduce failure caused by abnormal e-gun status, but also shorten the time needed for pump-down and material pre-melting.
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Swing-Out Source Tray
Source tray (where e-gun source is housed) can be swung out from the bottom of source chamber.
This feature enables users to refill materials or maintain the source chamber with great ease.
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Wire Feeder
The wire feeder feeds gold or other metal wire to the e-gun crucible without braking the vacuum.
It is especially useful for thick layer deposition.
With wire feeder, the deposition process is continuous without halting, which increases the throughput of the system.
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Lite Touch Clip
The pattened lite touch clip has been deisgned for keeping expensive III-V (GaAs, GaN, SiC) wafers fixed on the wafer carrier system without any damages.
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TCS Controlling Software
1. TCS is a PC-based software but it also works along side with PLC, enabling very comlicated system control and makes the operation smooth & stable.
2. TCS can work well with SECS / GEM SOFTWARE if needed for automatic production.
3. TCS can keep records of process-related information for tracking, analyzing and diagonising the process.
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Uniformity Mask Design ＆ Auratus
1. Since 1952, Temescal has been providing process consulting service to customers to reduce unnecessary waste of time for testing and developing parameters.
2. Temescal can design unique Uniformity Mask based on customers' specific requests, enabling thickness uniformity < 1.0%
3. Excellent expertise in e-beam evaporation technology, Temescal continues to innovate and redefine the industry standard.
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Pop-Top Gun Body
1. Movable crucible cover, which rises before crucible is rotated
2. Pneumatically driven, low-impact cover motion
3. Lip of cover recessed around exposed pocket
4. Raised structures on underside of cover interlock with crucible web walls
5. Virtual elimination of cross-contamination
6. Minimal deposition on web walls and on cover margins around exposed pocket
7. Reduced risk of damage to source and turret indexer
8. Removable/replaceable cover and crucible enable easy source convertibility
9. Enhanced crucible cooling improves thermal stability during evaporation
10. Adjustable internal and external pole piece extensions optimize beam spot control, regardless of beam position
11. Ultra-stable magnetics eliminate the need to regauss magnetic parts following source disassembly
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