PlasGenie® series is a set of feature-packed plasma processing tools, enabling users to perform functions such as surface cleaning, surface activation, surface etching, plasma coating and even plasma immersion ion implantation (PIII). PlasGenie® has been purposely designed to be equipped with an energy-concentrating plasma source, creating an area with high plasma density, which has been tested to be very effective in performing cleaning, activation etching and so on. Technical features include:
- Durable SUS304 plasma chamber for most applications
- Good plasma distribution uniformity with dia. 4" area
- Adjustable T/S for fine-tuning energy intensity
- Precise gas flow control by MFC
- Full-color touch screen with intuitive GUI
- Built-in safety interlocks to prevent maloperation
PG-02P：Desktop Plasma Cleaner
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| Plasma Chamber |
- Chamber material：SS304
- Hinged chamber door with 4" fine cooper-mesh covering the observing window
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| Plasma Source |
- Effective processing area：Dia. 4"
- RIE-type
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| Power Generator |
- 13.56 MHz, 300W with automatic matching network
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| Process Gas |
- 1 gas channel controlled by RF-resistant MFC
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| Vacuum System |
- Pumping unit：Mechnical rotary pump
- Measurement unit：Pirani gauge
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| System Control |
- PLC-based controlling system using touch screen
- System controls pumping sequence, process parameters setup, safety interlocks, data logging, system logs and so on
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| System Dimensions |
- 580mm (W) x 620mm (L) x 560mm (H)
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| Weight |
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PG-02S：Desktop Plasma-enhanced Sputtering System
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| Plasma Chamber |
- Chamber material：SS304
- Hinged chamber door with 4" fine cooper-mesh covering the observing window
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Plasma / Sputtering Source
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- Effective processing / coating area：Dia. 4"
- Exchangable cathode, top-mounted
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| Power Generator |
- 13.56 MHz, 300W with automatic matching network
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| Process Gas |
- 1 gas channel controlled by RF-resistant MFC
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| Vacuum System |
- Pumping unit：Mechnical rotary pump. High vacuum pump is available upon request.
- Measurement unit：Pirani gauge
|
| System Control |
- PLC-based controlling system using touch screen
- System controls pumping sequence, process parameters setup, safety interlocks, data logging, system logs and so on
|
| System Dimensions |
- 580mm (W) x 620mm (L) x 560mm (H)
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| System Weight |
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PG-02C：PECVD System
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| Plasma Chamber |
- Chamber material：SS304
- Hinged chamber door with 4" fine cooper-mesh covering the observing window
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| Plasma Source |
- Gas showerhead integrated
- Effective processing / coating area：Dia. 4"
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| Power Generator |
- 13.56 MHz, 300W with automatic matching network
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| Process Gas |
- 1 gas channel controlled by RF-resistant MFC
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| Precursor Module |
- x1 standard unit, including stainless container, conveying lines, valves and heaters
- x1 supporting frame for housing precursor module
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| Vacuum System |
- Pumping unit：Mechnical rotary pump
- Measurement unit：Pirani gauge
|
| System control |
- PLC-based controlling system using touch screen
- System controls pumping sequence, process parameters setup, safety interlocks, data logging, system logs and so on
|
| System Dimensions |
- 580mm (W) x 620mm (L) x 1230mm (H)
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| System Weight |
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