UV-curable High Barrier Adhesive for Encapsulation

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OLED devices are extremely sensitive to the oxygen & moisture content in the atmosphere. When exposed to atmosphere, the lifetime of OLED device will decrease dramatically, making it important to encapsulate OLED device as the final step of device fabrication. The most commonly used encapsulation method is glass-to-glass encapsulation. The interface between the 2 glasses has to be sealed with high barrier adhesive to block the passage for oxygen & moisture permeation. The UV-curable high barrier adhesives that we offer feautres high moisture barrier, low outgassing and flexible (particullay effective for fthe encapsulation of flexible OLEDs). Please see below table for more information.

SpecMoisture Cut WB90US (P)Moisture Cut WB90US-HV
Main contents Epoxy resin / Polymer Epoxy resin / Polymer

Before hardening

 

  • Appearance: Milky white
  • Density @25C: 1.4 g/cm3
  • Viscosity @25C: 200 Pa.s
  • Appearance: Milky white
  • Density @25C: 1.4 g/cm3
  • Viscosity @25C: 400 Pa.s
After hardening
  • WVTR:4 g/m2-24h
  • Outgas:< 20 ug/resin
  • Tensile Shear Strength:Material failure
  • Tg:120°C
  • Low coefficient of linear expansion:< 6.0 X 10-5/°C
  • Hardening condition (std.):6 J/cm2 + 80°C/1h
  • WVTR:4 g/m2-24h
  • Outgas:< 20 ug/resin
  • Tensile Shear Strength:Material failure
  • Tg:120°C
  • Low coefficient of linear expansion:< 6.0 X 10-5/°C
  • Hardening condition (std.):6 J/cm2 + 80°C/1h