有機EL封裝耗材 UV-curable High Barrier Adhesive

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有機元件(例如:OLED)對於大氣中的水氣與氧氣非常敏感,若沒有妥善的封裝,元件壽命會大幅減少。因此有機元件所使用的封裝材料,其高水氧阻隔功能為重要關鍵,此外封裝膠材與基板的封裝界面,如何隔絕水氣的穿透也是重要的課題。因應上述需求,我們提供的封裝膠材具備三大特點:高水氧阻隔性(high moisture barrier)低釋氣率(low outgassing)柔軟性(flexible,可應用於可撓式元件)。各款 UV 封裝膠的規格請參考下表。

SpecMoisture Cut WB90US (P)Moisture Cut WB90US-HV
Main contents Epoxy resin / Polymer Epoxy resin / Polymer

Before hardening

 

  • Appearance: Milky white
  • Density @25C: 1.4 g/cm3
  • Viscosity @25C: 200 Pa.s
  • Appearance: Milky white
  • Density @25C: 1.4 g/cm3
  • Viscosity @25C: 400 Pa.s
After hardening
  • WVTR:4 g/m2-24h
  • Outgas:< 20 ug/resin
  • Tensile Shear Strength:Material failure
  • Tg:120°C
  • Low coefficient of linear expansion:< 6.0 X 10-5/°C
  • Hardening condition (std.):6 J/cm2 + 80°C/1h
  • WVTR:4 g/m2-24h
  • Outgas:< 20 ug/resin
  • Tensile Shear Strength:Material failure
  • Tg:120°C
  • Low coefficient of linear expansion:< 6.0 X 10-5/°C
  • Hardening condition (std.):6 J/cm2 + 80°C/1h